Leading the advancement of integrated-circuit science and engineering technology, we develop state-of-the-art manufacturing techniques and explore novel information devices based on innovative mechanisms, materials, and paradigms. Significant efforts are dedicated to overcoming the "bottleneck" challenges in the integrated-circuit industry. Our research encompasses basic materials, device theory, manufacturing processes, and system integration. We focus on cutting-edge manufacturing processes at the angstrom scale, next-generation logic and memory devices, low-dimensional semiconductors, wide-bandgap semiconductors, flexible semiconductors, and other emerging technologies, as well as three-dimensional integration techniques.
