主要开展压电MEMS、超声MEMS、传感器与执行器的设计、加工以及系统集成相关技术研究。其中在压电微型超声传感器（PMUT）的机理、关键工艺、微系统集成和产业化做出了原创性、系统性、突破性的贡献，实现了CMOS集成的PMUT阵列，并将其应用于超声指纹识别传感器，核心技术专利被行业内领军公司竞买并产业化。在高通先进技术研发部主导开发的全球首例微型超声指纹传感器芯片已实现大规模量产，出货超过数亿颗。迄今为止，在集成微纳系统和传感器领域顶级期刊（JMEMS, JSSC, TUFFC, APL等）和会议（MEMS, ISSCC, Transducers, IUS等）发表文章37篇，拥有美国专利32项（其中20余项已转让或形成产品并量产），英文书籍章节一项，并多次获得重要奖项包括MEMS，ISSCC会议最佳论文，the BEST of BSAC，Super Qualcomm Star等。担任领域内顶级国际期刊IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control (UFFC) 副主编，顶级会议Solid-State Sensors, Actuators and Microsystems （Hilton Head） 2022技术委员会委员，IEEE SFBA MEMS & Sensor Chapter 委员会委员（2016-2022）。
Publications/Google scholar: https://scholar.google.com/citations?user=7cRd6e4AAAAJ
代表性论著：
1. Y. Lu, H. Tang, S. Fung, Q. Wang, J.M. Tsai, M. Daneman, B.E. Boser, and D.A. Horsley, " Ultrasonic Fingerprint Sensor Using a Piezoelectric Micromachined Ultrasonic Transducer Array Integrated with CMOS Electronics", Applied Physics Letters, 106, p. 263503, 2015 (Cover)
2. Y. Lu, H. Tang, S. Fung, B.E. Boser, and D.A. Horsley, "Pulse-Echo Ultrasound Imaging Using an AlN Piezoelectric Micromachined Ultrasonic Transducer Array with Transmit Beam-Forming", J. Microelectromechanical Systems, 99, pp. 1-9, 2016
3. Y. Lu, H. Tang, Q. Wang, S. Fung, J.M. Tsai, M. Daneman, B.E. Boser, and D.A. Horsley, "Waveguide piezoelectric micromachined ultrasonic transducer array for short-range pulse-echo imaging", Applied Physics Letters, 106, p. 193506, 2015
4. Y. Luand D.A. Horsley, "Modeling, Fabrication and Characterization of Piezoelectric Micromachined Ultrasonic Transducer Arrays Based on Cavity SOI Wafers", J. Microelectromechanical Systems, 24(4), pp. 1142-1149, 2015
5. Y. Lu, A. Heidari, and D.A. Horsley, "A High Fill-Factor Annular Array of High Frequency Piezoelectric Micromachined Ultrasonic Transducers", J. Microelectromechanical Systems, 24(4), pp. 904-913, 2015
6. X. Jiang, Y. Lu, H.Y. Tang, J.M. Tsai, E.J. Ng, M.J. Daneman, B.E. Boser, D.A. Horsley, “Monolithic Ultrasound Fingerprint Sensor”, Microsystems & Nanoengineering - Nature, Vol. 3, p. 17059, 2017
7. H.Y. Tang, Y. Lu, X. Jiang, E.J. Ng, J.M. Tsai, D.A. Horsley, B.E. Boser, “3-D Ultrasonic Fingerprint Sensor-on-a-Chip”, IEEE Journal of Solid-State Circuits, 51 (11), 2016
8. Y. Lu, X. Wu, W. Zhang, W. Chen, et al, “Research on Reference Vibration for Two-axis Piezoelectric Micro-Machined Gyroscope” Journal of Micromechanics and Microengineering, 20 (07), p. 5039, 2010
9. Q. Wang, Y. Lu, S. Mishin, Y. Oshmyansky, D.A. Horsley, Design, Fabrication, and Characterization of Scandium Aluminum Nitride-Based Piezoelectric Micromachined Ultrasonic Transducers, J. Microelectromechanical Systems, 26 (5), pp. 1132-1139, 2017
10. Y. Lu,X. Wu, W. Zhang, and W. Chen, “Optimization and Analysis of Novel Piezoelectric Solid Micro-Gyroscope with High Resistance to Shock” Microsystem technologies, 16, pp. 571–584, 2010
11. Y. Lu, H. Tang, S. Fung, B. E. Boser, and D. A. Horsley, "Short-Range and High-Resolution Ultrasound Imaging Using an 8 MHz Aluminum Nitride PMUT Array," IEEE MEMS, pp. 140-143, 2015. Best Paper Award Finalist
12. Y. Lu, O. Rozen, H. Tang, G.L. Smith, S. Fung, B.E. Boser, R.G. Polcawich, D.A. Horsley, "Broadband piezoelectric micromachined ultrasonic transducers based on dual resonance modes," IEEE MEMS, pp. 146-149, 2015
13. Y. Lu, A. Heidari, S. Shelton, A. Guedes and D.A. Horsley, "High frequency piezoelectric micromachined ultrasonic transducer array for intravascular ultrasound imaging," IEEE MEMS, pp. 745-748, 2014
14. Y. Lu, S. Shelton and D.A. Horsley, "High frequency and high fill factor piezoelectric micromachined ultrasonic transducers based on cavity SOI wafers", Solid-State Sensors, Actuators and Microsystems Workshop (Hilton Head), pp. 131-134, 2014
15. H. Tang, Y. Lu, F. Assaderaghi, M. Daneman, X. Jiang, M. Lim, X. Li, E. Ng, U. Singhal, J.M.Tsai, D.A. Horsley, B.E. Boser, “3-D Ultrasonic Fingerprint Sensor on a Chip”, ISSCC, pp. 202-203, 2016, Lewis Winner Award
16. H. Tang, Y. Lu, S. Fung, D.A. Horsley, B.E. Boser, "Integrated Ultrasonic System for Measuring Body-Fat Composition", ISSCC, pp. 1-3, 2015
17. X. Jiang, H. Tang, Y. Lu, X. Li, J.M.Tsai, E. Ng, M. Daneman, M. Lim, F. Assaderaghi, B.E. Boser, D.A. Horsley, “Monolithic 591×438 DPI Ultrasonic Fingerprint Sensor”, IEEE MEMS, pp. 107-110, 2016 Best Paper Award
18. Y. Lu, Q. Wang, and D.A. Horsley, “Piezoelectric Micromachined Ultrasonic Transducers with Increased Coupling Coefficient via Series Transduction”, IEEE International Ultrasonics Symposium (IUS), pp. 1-4, 2015
19. H. Tang, Y. Lu, S. Fung, J.M. Tsai, M. Daneman, D.A. Horsley, B.E. Boser, “Pulse-echo ultrasonic fingerprint sensor on a chip”, Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), pp. 674-677, 2015
20. X. Jiang, H. Tang, Y. Lu, E.J. Ng, J.M. Tsai, B.E. Boser, D.A. Horsley，“Ultrasonic Fingerprint Sensor With Transmit Beamforming Based on a PMUT Array Bonded to CMOS Circuitry”, IEEE Transactions on UFFC, 64(9), pp1401-1408, 2017
代表性知识产权：
1. Y. Lu, D.A. Horsley, H. Tang, and B.E. Boser, “MUT Fingerprint ID System”, 2014, US Patent 14/896,150.已转让并产业化（被业界领军公司竞买，被其他美国专利他引43次）。
2. Y. Lu, H.Y., Tang, H.V. Panchawagh, “Superpixel Array of Piezoelectric Ultrasonic Transducers for 2-D Beamforming”, 2016, US Patent US 14/883,586.
3. Y. Lu, D.W. Burns, “Biometric System with Photoacoustic Imaging”, 2017, US Patent 15/149, 048. 生物识别、人机交互传感
4. Y. Lu, D.W. Burns, “Biometric system with photoacoustic imaging”, 2017, US Patent 15/149,046. 医疗健康。
5. Y. Lu, J.L. Strohmann, H.V. Panchawagh, “Reducing background signal in imaging sensors”, 2019, US Patent 10,817,694.
6. Y. Lu, H.V. Panchawagh, K.D. Djordjev, J.H. Seo, N.I. Buchan, C.J. Tseng, T Kao, “Ultrasonic fingerprint sensor with flexible substrate”, 2020, US Patent 16/525,030.。
7. Y. Lu, H.V. Panchawagh, K.D. Djordjev, C.J. Tseng, N.I. Buchan, T. Kao, J.H. Seo, “Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer”, 2019, US Patent App. 16/252,408.
8. Y. Liang, Y. Lu, H.V. Panchawagh, J.L. Strohmann, C. Xu, Temperature and ultrasonic sensor fusion for biometric sensing, 2020, US Patent 11/182,026.
9. Y. Kusano, Y. Lu, J.L. Strohmann, H.V. Panchawagh, Ultrasonic sensor array, 2019, US Patent 16/455,472.
10. Y. Lu, J.L. Strohmann, I Badge, H.V. Panchawagh, T. Kao, Apparatus and method for improved biometric sensing, 2019, US Patent 16/544,681.
11. H. Tang, Y. Lu, H.V. Panchawagh, Active beam-forming technique for piezoelectric ultrasonic transducer array, 2018, US Patent 14/883,585.
12. Y. Lu, H.V. Panchawagh, J.L. Strohmann, K.D. Djordjev, “Ultrasonic sensor array control to facilitate screen protectors”, 2020, US Patent 16/414,164.
13. J.L. Strohmann, Y. Lu, H.V. Panchawagh, “Broadband ultrasonic sensor”, 2020, US Patent 16/407,070.
14. J.L. Strohmann, Y. Lu, A. Hinger, D.W. Burns, Ultrasonic biometric system with harmonic detection, 2018, US Patent App. 15/804,902
15. D.A. Horsley, Y. Lu, O. Rozen, 书籍"Piezoelectric MEMS Resonators", 章节6，"Flexural Piezoelectric Resonators", 153-173, Springer International Publishing，2017.
